subject
Engineering, 23.02.2021 07:50 kcarstensen59070

Type of integrated circuit package ​

ansver
Answers: 3

Another question on Engineering

question
Engineering, 03.07.2019 14:10
If the thermal strain developed in polyimide film during deposition is given as 0.0044. assume room temperature is kept at 17.3 c, and thermal coefficient of expansion for the film and the substrate are 54 x 10^-6c^-1 and 3.3 x 10^-6c^-1respectively. calculate the deposition temperature.
Answers: 3
question
Engineering, 04.07.2019 18:10
Asingle-geared blanking press has a stroke of 200 mm and a rated capacity of 320 kn. a cam driven ram is assumed to be capable of delivering the full press load at constant force during the last 15 percent of a constant-velocity stroke. the camshaft has an average speed of 90 rev/min and is geared to the flywheel shaft at a 6: 1 ratio. the total work done is to include an allowance of 16 percent for friction a) estimate the maximum energy fluctuation b) find the rim weight for an effective diameter of 1.2 m and a coefficient of speed fluctuation of 0.10
Answers: 1
question
Engineering, 04.07.2019 19:10
Analyze the factors that influence the choice between the following pairs of processes to make the products indicated: i) sand casting versus die casting of an electric-motor housing ii) thread rolling versus machining of a bolt for high-strength application. (co3/c5)
Answers: 3
question
Engineering, 06.07.2019 03:10
Steel balls 12 mm in diameter are annealed by heating to 1150 k and then slowly cooled to 400 k in an air att 325 k and h -20 w/m2 k. assume the properties of the steel to be k- 40 w/m k,p 7800 kg/m3, and cp 600 j/kg k. a. determine whether lumped system method can be used to analyze this problem and if so why" b. determine the time required for the cooling process. c. determine the total amount of heat lost from each ball to the ambient air
Answers: 1
You know the right answer?
Type of integrated circuit package ​...
Questions
Questions on the website: 13722360