Physics, 04.12.2019 06:31 ebt2367

2. a package with a heat sink and fan has a thermal resistance to the ambient of 8 °c/w. the thermal resistance from the die to the package is 2 °c/w. if the package is in a chassis that will never exceed 50 °c and the maximum acceptable die temperature is 110 °c, how much power can the chip dissipate?

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2. a package with a heat sink and fan has a thermal resistance to the ambient of 8 °c/w. the thermal...

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