Mathematics, 20.07.2020 01:01 dontcareanyonemo
Describes an experiment for investigating a method for aligning optical chips onto circuit boards. The method involves placing solder bumps onto the bottom of the chip. The experiment used three solder bump sizes and three alignment methods. The response variable is alignment accuracy (in micrometers). The data is given below:
Solder Bump Size Alignment Method
1 2
75 4.6 1.05
5.53 1.00
2.33 0.82
130 2.44 0.95
a. Is there any indication that either solder bump size or alignment method affects the alignment accuracy? Is there any evidence of interaction between these factors? Use α= 0.05.
b. What recommendations would you make about this process?
c. Analyze the residuals from this experiment. Comment on model adequacy.
Answers: 2
Mathematics, 21.06.2019 17:40
The graph of h(x)= |x-10| +6 is shown. on which interval is this graph increasing
Answers: 2
Mathematics, 21.06.2019 18:30
You receive 15% of the profit from a car wash how much money do you receive from a profit of 300
Answers: 2
Mathematics, 21.06.2019 21:40
Drag the tiles to the correct boxes to complete the pairs. using the properties of integer exponents, match each expression with the correct equivalent expression.
Answers: 1
Mathematics, 21.06.2019 22:00
What value is a discontinuity of x squared plus 8 x plus 4, all over x squared minus x minus 6?
Answers: 2
Describes an experiment for investigating a method for aligning optical chips onto circuit boards. T...
Computers and Technology, 15.07.2020 01:01
Mathematics, 15.07.2020 01:01
Mathematics, 15.07.2020 01:01
Computers and Technology, 15.07.2020 01:01
Mathematics, 15.07.2020 01:01