Briefly describe one application/materials system in which a high diffusion rate is desirable, and one application/materials system in which a high diffusion rate is undesirable. Note: Your answer should not be based on case hardening of steel and doping semiconductors are discussed in the lectures and textbook.

The thermal expansion or contraction of a given metal is a function of the f a)-density b)-initial temperature c)- temperature difference d)- linear coefficient of thermal expansion e)- final temperature f)- original length

Refrigerant-134a enters the compressor of a refrigerator as superheated vapor at 0.14 mpa and -10°c at a rate of 0.05 ka/s and leaves at 0.8 mpa and 50°c. the refrigerant is cooied in the condenser to 0.72 mpa and 26'c. it is then throttled to 0.15 mpa. sketch the t-s diagram for the system and evaluate: 6) the rate of heat removai from the refrigerated space (kw), it) the power input to the compressor (kw), ii) the isentropic efficiency of the compressor (%), and iv) the cop of the refrigerator.

For each of the following process: a) sketch the p-v diagram, b)sketch t-s diagram, c) sketch t-v diagram, d) sketch the boundary work on one of the diagrams (a, b or c) and e) sketch the reversible heat transfer on one of the diagrams (a, b or c): 1- isobaric process from compressed liquid to superheated vapor 2- isothermal process from compressed liquid to superheated vapor 3- isentropic process from compressed liquid to superheated vapor