For Figure Below, if the elevation of the benchmark A is 25.00 m above MSL: 1. Using the Rise and Fall Method, find the reduced level for all points. (Construct the Table)
2. Using HPC Method, find the reduced level for all points. ( Construct the Table).
3. Show all required Arithmetic checks for your work. For Item 1 and 2.
4. What is the difference in height between points H and D?
5. What is the gradient of the line connecting A and J, knowing that horizontal distance = 200
m.

1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction