A thin film of radioactive copper was electroplated on the end of a copper cylinder. After a high temperature anneal of 20 hours, the specimen was sectioned and the following profile of the radioactive copper was obtained. distance (cm) concentration (atom fraction)
0.005 0.168
0.01 0.157
0.02 0.119
0.03 0.075
0.04 0.039
0.05 0.017
0.06 0.006
(a) Determine the tracer ( ∗ iD ) and self (Di) diffusion coefficient of copper.
(b) Using ∗ iD , plot the concentration profile of electroplated radioactive copper after high temperature anneal of 40 hours.