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If the thermal strain developed in polyimide film during deposition is given as 0.0044. assume room temperature is kept at 17.3 c, and thermal coefficient of expansion for the film and the substrate are 54 x 10^-6c^-1 and 3.3 x 10^-6c^-1respectively. calculate the deposition temperature.

Draw the engineering stress-strain curve for (a) bcc; (b) fcc metals and mark important points.

Slip occurs via two partial dislocations because of (a) the shorter path of the partial dislocation lines; (b) the lower energy state through partial dislocations; (c) the charge balance.