Which product contains a strong base that would most likely completely dissolve in wster

If the thermal strain developed in polyimide film during deposition is given as 0.0044. assume room temperature is kept at 17.3 c, and thermal coefficient of expansion for the film and the substrate are 54 x 10^-6c^-1 and 3.3 x 10^-6c^-1respectively. calculate the deposition temperature.

Afluid flows with a velocity field given by v=(x/t)i.. determine the local and convective accelerations when x=3 and t=1.

Draw the engineering stress-strain curve for (a) bcc; (b) fcc metals and mark important points.