Engineering, 03.03.2020 04:27 autumnmeadows20
The substitutional diffusion of Ni (solute) in Cu (solvent) is a a. thermally activated process (improves with temperature) b. increases in rate with increasing temperature c. requires the presence of vacancies d. all of the above
Answers: 2
Engineering, 04.07.2019 18:20
Ahe-xe mixture containing a 0.75 mole fraction of helium is used for cooling electronics in an avionics application. at a temperature of 300 k and atmospheric pressure, calculate the mass fraction of helium and the mass density, molar concentration and molecular weight of the mixture. if the cooling capacity is 10 l, what is the mass of the coolant?
Answers: 3
Engineering, 04.07.2019 18:20
The characteristic roots of a dynamic system are: 1.7920 1.8160 i, -1.7920 1.8160 i, -0.4160 what is the order of this system? what are the settling time and damping ratio of the system?
Answers: 3
Engineering, 04.07.2019 18:20
Find the minimum film thickness for a journal bearing with the data below. shaft diameter, d-50 mm, clearance ratio, cdratio? 0.001, shaft speed, n 2000 rpm; bearing length. i 200 mm; eccentricity ration, ? -0.55. ( note, cdratio-ca/d) the minimum film thickness is um
Answers: 2
Engineering, 04.07.2019 19:10
How to increase the thermal officiency of an ideal simple rankino cycle? among these methods, which one is the best and why?
Answers: 2
The substitutional diffusion of Ni (solute) in Cu (solvent) is a a. thermally activated process (imp...
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