A transparent film is to be bonded onto the top surface of a solid plate inside a heated chamber. For the bond to cure properly, a temperature of 70°C is to be maintained at the bond, between the film and the solid plate. The transparent film has a thickness of 0.009 m and thermal conductivity of 0.05 W/m·K, while the solid plate is 0.017 m thick and has a thermal conductivity of 1.2 W/m·K. Inside the heated chamber, the convection heat transfer coefficient is 70 W/m2·K. The bottom surface of the solid plate is maintained at 52°C. Assume thermal contact resistance is negligible. Determine the temperature inside the heated chamber and the surface temperature of the transparent film.