A thin silicon chip and an 8-mm-thick aluminum substrate are separated by a 0.02mm-thick epoxy joint. The chip and substrate are each 10mm on a side, and their exposed surface are cooled by air, which provides a temperature of 25 degree C and a convection coefficient of 100W/m^2 K. If the chip dissipates 104W/m^2 under normal conditions, will it operate below a maximum allowable temperature of 85 degree C? Solve this problem using thermal circuit analysis. The following approximations can be made Since the chip is thin, you can assume that its temperature is uniform within. There is no resistance for heat transfer across interfaces between different materials. Thermal conductivities of aluminum and epoxy are 239 and 0.35 W/m middot K, respectively.