The electronic packaging trend in the memory chip industry has seen the evolution from using a tsop package to a low cost solder bumped csp with a flexible interposer. what advantages does the csp have over the tsop?

Air is to be cooled in the evaporator section of a refrigerator by passing it over a bank of 0.8-cm-outer-diameter and 0.4-m-long tubes inside which the refrigerant is evaporating at -20°c. air approaches the tube bank in the normal direction at 0°c and 1 atm with a mean velocity of 4 m/s. the tubes are arranged in-line with longitudinal and transverse pitches of sl- st 1.5 cm. there are 30 rows in the flow direction with 15 tubes in each row. determine (a) the refrigeration capacity of this system and (b) pressure drop across the tube bank. evaluate the air properties at an assumed mean temperature of -5°c and 1 atm. is this a good assumption?

An air compression refrigeration system is to have an air pressure of 100 psia in the brine tank and an allowable air temperature increase of 60°f for standard vapor compression cycle temperatures of 77 f entering the expansion cylinder and 14 f entering the compression cylinder, calculate the coefficient of performance a. 2.5 b 3.3 c. 4.0 d. 5.0

Explain the strain-hardening phenomenon on the basis of dislocation - dislocation strain field interactions. also, briefly describe what generally happens to the ductility of a metal that has been strain hardened (i.e. does strain hardening make a metal more ductile or