Engineering, 30.10.2019 07:31 paralaw61772
To enhance heat transfer from a silicon chip of width : 4 mm on a side, a copper pin fin is brazed to the surface of the chip. the pin length and diameter are / 12 mm and ' 2 mm, respectively, and atmospheric air at 9 10 m/s and 7 300 k is in cross flow over the pin. the surface of the chip, and hence the base of the pin, are maintained at a temperature of 7e 350 k. calculate the average heat convection coefficient from the surface of the fin. neglect the effect of the chip on the flow and the fin tip. using the he value from (a) determine the pin fin heat transfer rate. assuming the he value above applies for the chip itself too: determine the total heat loss from the chip and fin.
Answers: 1
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To enhance heat transfer from a silicon chip of width : 4 mm on a side, a copper pin fin is brazed...
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