Engineering, 13.09.2019 22:30 hollie62
The yield of good chips in multiprobe for a certain batch of wafers is 75%. the wafers have a diameter of 300 mm with a processable area that is 280 mm in diameter. if the defects are all assumed to be point defects, determine the density of point defects using the bose-einstein method of estimating yield.
Answers: 2
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