The heat generated in the circuitry on the surface of a silicon chip (k=130 w/m°c) is conducted to the ceramic substrate to which it is attached. the chip is 6 mm × 6 mm in size and 0.5 mm thick and dissipates 3 w of power. disregarding any heat transfer through the 0.5 mm high side surfaces, determine the temperature difference between the front and back surfaces of the chip in steady operation

Air is to be cooled in the evaporator section of a refrigerator by passing it over a bank of 0.8-cm-outer-diameter and 0.4-m-long tubes inside which the refrigerant is evaporating at -20°c. air approaches the tube bank in the normal direction at 0°c and 1 atm with a mean velocity of 4 m/s. the tubes are arranged in-line with longitudinal and transverse pitches of sl- st 1.5 cm. there are 30 rows in the flow direction with 15 tubes in each row. determine (a) the refrigeration capacity of this system and (b) pressure drop across the tube bank. evaluate the air properties at an assumed mean temperature of -5°c and 1 atm. is this a good assumption?

Adouble-strand no. 60 roller chain is used to transmit power between a 13-tooth driving sprocket rotating at 300 rev/min and a 52-tooth driven sprocket. a) what is the allowable horsepower of this drive? b) estimate the center-to-center distance if the chain length is 82 pitches. c) estimate the torque and bending force on the driving shaft by the chain if the actual horsepower transmitted is 30 percent less than the corrected (allowable) power.

Draw the engineering stress-strain curve for (a) bcc; (b) fcc metals and mark important points.